DuPont Pyralux ML Series of double-sided metal-clad laminates for flexible and rigid-flex printed circuit boards (PCBs) were developed for optimal thermal management in aerospace, defense, electric vehicles (EV), artificial intelligence (AI) related networking, and other electronic devices.
The series works well in challenging environments for many different applications, addressing the challenges of thermal management for flexible printed circuits, sensors, heaters, and thermocouples.
Pyralux ML contains metal alloys, such as copper-nickel (CuNi), featuring Kapton all-polyimide dielectric technology. The alloys provide thermal resistance for heating, thermal conductivity to improve heat transfer, resistivity for heat output, and thermoelectric properties as needed for the application.
Available in a variety of dielectric and foil types, thicknesses, and a range of metal constructions, they are fully compatible with most conventional circuit fabrication processes.
DuPont
Wilmington, DE
www.dupont.com
